01. Die Bonding
Secure silicon dies onto customized substrate surface per customer needs.
Capable of handling many special dies (e.g. MEMS dies) with proven processes
02. Wire Bonding:
Make the fine-pitch wire connector between silicon dies to the outside world.
Capable of prototyping unique wiring path and special surfaces.
03. Optical Coupling
Align fiber to the designated position to ensure optimal performance.
04. Mems Device Customization
Specilized in MEMS chip package, optical design and control integration, e.g. MEMS optical switch
05. Device Assembly
Develop and implement optical module and equipment assembling process based on customized requirements.
Procure standard and customized components on behave of end customers.
06. Equipment Testing
Measure electrical and optical parameters to verify the specification compliance.
Conduct standard environmental tests per customer's specification.